Nomenklatur

Übersicht der verwendeten Abkürzungen

HMD oder THD  Durchsteckmontage 
SMT  Oberflächenmontage 
PCB  Schaltungsträger (gedruckte Schaltung) 
BE  Bauelement 
µBGA Mikro Ball Grid Array

SMT

ASIC Application Specific Integrated Circuit

BE

BGA Ball Grid Array

SMT

C-Flat Pack Ceramic Flat Pack

SMT

C-LCC Ceramic Leaded Chip Carrier

SMT

CMC Ceramic Multilayer Capacitor

SMT

COB Chip on Board

SMT

C-PGA Ceramic Pin Grid Array

HMT/THD

CSP Chip Scale Package

-

DIP Dual Inline Package

HMT/THD

DRAM Dynamic Random Access Memory

BE

FC Flip Chip

SMT

FCIP Flip Chip in Package

-

FCOB Flip Chip on Board

SMT

FPC Flexible Printed Circuit

PCB

LB Lead Bonding

-

LF Lead Frame

-

OSC Odd Shaped Component

BE

MCM Multi Chip Module

SMT

MID Molded Interconnection Device

PCB

RCC Resin Coated Copper

PCB

PCB Printed Circuit Board

PCB

P-LCC Plastic Leaded Chip Carrier

SMT

P-QFP Plastic Quad Flat Pack

SMT

P-SO Plastic Small Outline

SMT

P-TSOP Plastic Thin Small Outline Package

SMT

SIP Single Inline Package

HMT/THD

SMD Surface Mount Device

SMT

SMT Surface Mount Technology

SMT

SO Small Outline

SMT

SOD Small Outline Diode

SMT

SOJ Small Outline J-Lead

SMT

SOT Small Outline Transistor

SMT

SSOP Shrink Small Outline Package

SMT

TAB Tape Automated Bonding

SMT

TCP Tape Carrier Package

SMT

THP Through Hole Package

HMT/THD

THT Through Hole Technology

HMT/HMD

TO Transistor Outline

BE

TSOP II Thin Small Outline Package, Typ II

SMT

UTSOP Ultra Thin Small Outline Package

SMT

ZIP Zigzag Inline Package

HMT/THD