Analytics
Special examinations
- Metallographic preparation, weight determination up to 0.1mg
- Optical inspection with microscopes and by means of micro endoscopy (incident light, transmitted light, interference contrast, polarised light, UV light)
- Lasertopography (roughness measurement, optical surface scan up to 10 nm, max. sample size 300 x 300 mm)
- SEM (scanning electron microscopy) with EDX / WDX, sonography, temperature entropy diagram
- 2D X-ray, max. sample size 300 x 400 x 30 mm, resolution up to 5 µm
- XRF (layer thickness determination + substance analysis)
- Infrared spectroscopy (FTIR)
- Ionic contamination measurement (IPC-TM-650)
- Hardness tests/µ-hardness tests (Shore, Knoop, Rockwell, Vickers, Brinell)
- Dye an Pry Test for the detection of cracks (micro cracks) in BGA solder joints
Combined tests
- Burn-in and Run-in: e.g. MIL-STD-202
- Temperature change with superimposed electrical load: down to -45°C and up to 1,5kW electrical dissipation loss of sample VW 801.01 life cycle, internal power cycling
- Qualification of PCBs: Schocktest (solder bath, oil bath, sand bath); surface adhesion (ENIG, keyword: black pad)
- Qualification of PCBs: Substrate bending test, shear test, pull test; Ceramic Chip Capacitor: Burn-in and Voltage Conditioning MIL-STD-202, Tmax: 175°C Umax: 300V DC; Tantal-Elko: Surgetest, Parametertest MIL-PRF- 55365; Induktivities with DC-Bias
- Solderability test: wetting tests in accordance with DIN EN 60068-2-20, 2-58, 2-69
