MicroFluxBrush
Microbrushes
The novel and patented MicroFluxBrush series by TechnoLab allows for the first time to mechanically remove persistent contamination from particularly hard to reach areas, e.g. directly under BGAs. The specially designed brushes are available with wire diameters of 0.22mm, 0.45mm and 0.65mm.
The brushes, which can be operated manually or incited by ultrasound, are particularly well suited to clean all hidden and otherwise hardly accessible areas such as under BGA, QFP, PLCC and nearly all related SMT components. This is especially important for repair and/or rework processes where quite substantial flux residues frequently remain under the components and which can now be removed quickly and efficiently by the MicroFluxBrush.
The MicroFluxBrush makes it possible to easily meet the high safety standards by the aviation and space industries where contamination through solder balls, flux and other metallic and non-metallic residues must be removed, if not avoided. It is not an issue anymore in which small areas the residues and contaminations are located.
The MicroFluxBrush can not only be used in its typical application in the electronics industry but also serves its purpose well in cleaning fine mechanical products such as miniature valves or connectors in the aviation and space industry.
All brushes meet the requirements for ESD safe tools.
