Nomenclature
List of abbreviations
| HMD or THD | through-hole assembly |
| SMT | surface mount assembly |
| PCB | Printed Circuit Board |
| BE | component |
| µBGA | Mikro Ball Grid Array |
SMT |
| ASIC | Application Specific Integrated Circuit |
BE |
| BGA | Ball Grid Array |
SMT |
| C-Flat Pack | Ceramic Flat Pack |
SMT |
| C-LCC | Ceramic Leaded Chip Carrier |
SMT |
| CMC | Ceramic Multilayer Capacitor |
SMT |
| COB | Chip on Board |
SMT |
| C-PGA | Ceramic Pin Grid Array |
HMT/THD |
| CSP | Chip Scale Package |
- |
| DIP | Dual Inline Package |
HMT/THD |
| DRAM | Dynamic Random Access Memory |
BE |
| FC | Flip Chip |
SMT |
| FCIP | Flip Chip in Package |
- |
| FCOB | Flip Chip on Board |
SMT |
| FPC | Flexible Printed Circuit |
PCB |
| LB | Lead Bonding | - |
| LF | Lead Frame | - |
| OSC | Odd Shaped Component |
BE |
| MCM | Multi Chip Module |
SMT |
| MID | Molded Interconnection Device |
PCB |
| RCC | Resin Coated Copper |
PCB |
| PCB | Printed Circuit Board |
PCB |
| P-LCC | Plastic Leaded Chip Carrier |
SMT |
| P-QFP | Plastic Quad Flat Pack |
SMT |
| P-SO | Plastic Small Outline |
SMT |
| P-TSOP | Plastic Thin Small Outline Package |
SMT |
| SIP | Single Inline Package | HMT/THD |
| SMD | Surface Mount Device |
SMT |
| SMT | Surface Mount Technology |
SMT |
| SO | Small Outline |
SMT |
| SOD | Small Outline Diode |
SMT |
| SOJ | Small Outline J-Lead |
SMT |
| SOT | Small Outline Transistor | SMT |
| SSOP | Shrink Small Outline Package | SMT |
| TAB | Tape Automated Bonding | SMT |
| TCP | Tape Carrier Package | SMT |
| THP | Through Hole Package | HMT/THD |
| THT | Through Hole Technology | HMT/HMD |
| TO | Transistor Outline |
BE |
| TSOP II | Thin Small Outline Package, Typ II |
SMT |
| UTSOP | Ultra Thin Small Outline Package |
SMT |
| ZIP | Zigzag Inline Package |
HMT/THD |