SMD/HMD
1. Evident deficiencies
2. Partly acceptable / tolerable deficiencies
- Blowhole, crater
- Solder cluster
- Solder icicle
3. Residues
- Solder residues / microballs
- Solder residues / webbing
- Solder residues / lugs, studs
- Non-metallic residues / flux residues
- Non-metallic residues / residues of qualified non-conducting sustances (other than flux)
- Non-metallic residues / undefined non-metallic residues
4. Constant deviations (non-evident deficiencies)
5. Other deficiencies
- Abnormal surface of soldering joint (butt, rough, granular, burls)
- Defective solder fillet
- Solder paste not completely molten
- Poor solder fillet in through-hole
- Wicking
- Dewetting
- Inclusion of foreign particles
- Cavities, pores
- Solder under SMD body
- Discolouring of laminate
6. Component-implied assembly faults
- Damaged CMCs
- Damaged components with plastic housing
- Damaged BGAs, defective solder joints
- Damaged CSPs