The way we investigate technical failures, apply various methods and collate the individual findings is very much like forensic investigation work.
The methods comply with the guideline VDI/VDE 3822 Blatt1 Schadensanalyse (defect analysis). Optical/Visual inspection, metallographic preparation and material analysis serve to detect and document weak points. The results of the analysis are compiled in an expert‘s report; we also act as experts in cases of litigation.
Analyses aim at finding technical evidenceOur technical equipment and extensive know-how permit an effective examination with a high evidentiary value concerning defective objects or objects which are suspected defective. A critical chain of evidence can moreover be substantiated by simulating the defect mechanism.
Our activities focus on electronic assemblies, their fields of application and relevant processes.
An important and integral part of a defect analysis consists in developing solutions and improvements for the production process. This joint effort with the ordering party is aimed at avoiding future failure and reducing any possible warranty and loss of good-will.