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Failure analysis

Analytics
Test procedure

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Analytics
  • Optical Inspection by Microscope and Micro-Endoscope

    • bright field
    • dark field
    • interference
    • polarization
    • UV-light

  • Laser Topography

    • Optical surface scan
    • roughness measurement
    • maximum sample size 300 x 300 mm
    • resolution down to 10 nm

  • Metallographic Preparation

    • maximum microsection surface 160 x 30 mm

  • Dye and Pry Test

    • Proof of cracks (microcracks) in BGA solder connections

  • Light Optical and Scanning Electron Microscopy (SEM)

    • SEM inspection + analysis by means of energy or wavelength dispersive X-ray spectroscopy (EDX / WDX)

  • X-Ray and Ultrasonic Microscopy

    • maximum sample size 500 x 500 mm, resolution down to 5 µm

  • X-Ray Fluorescence (RFA / XRF)

    • Qualitative and quantitative determination of elementary composition and layer thickness determination

  • Fourier-Transform Infrared Spectroscopy (FTIR)

    • Identification of organic substances (polymers, adhesives, flux...)

  • Measurement of Ionic Contamination (J-STD-001 / IPC-TM-650)

    • Proof of ionogenic contamination of assemblies (e.g. process residue from PCB production, flux residues, handling residues...)
    • Process adaptation to customer specifications

  • Hardness tests

    • According to Shore, Knoop, Rockwell, Vickers, Brinell

Factors contributing to the occurrence of a defect


  1. Constructional faults
    • faulty dimensioning
    • faulty selection of materials
    • faulty process selection
    • faulty documentation
  2. Production faults
    • shortcomings in the process chain
    • shortcomings of the vendor parts
    • shortcomings in the adaption of parameters
  3. Storage / Transport
  4. Operational faults
    • operating and maintenance faults
    • consequential damage (wear and tear, corrosion,...)
    • overload
  5. Acts of God
Fire damage
Fire damage

Systematic Sequence of a Defect Analysis

Defective Object

• Damage description

Stock-taking

• Determination of the defect event sequence and the background

Defect Hypothesis

• Circumscription of possible causes

Selection of Investigation Methods

• Non-destructive tests, destructive tests,..., simulation efforts

Tests / Examinations

• Taking of sample - component - material - evaluation defect neighbourhood

Evaluation of Examination Results

• Target - Performance - Comparison

Defect Cause

• Definition of defect type and cause

Defect Prevention

Defect Report


Documentation


  • Microscopic Inspection
    Microscopic Inspection
  • Metallographic Preparation
    Metallographic Preparation
  • Microsection
    Microsection
  • Optical Inspection
    Optical Inspection
  • Documentation
    Documentation
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