Test procedure

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  • Microsection - PCB
    Microsection - PCB
  • Pull-Test
  • Solder ball
    Solder ball

Qualification of printed circuit boards

  • Compliance with rules and regulations as per IPC-A-600, IEC 61288, e.g. thermal resistance (solder bath, oil bath, sand bath), solderability as per J-STD-003
  • Evaluation of surface finishes (electroless Sn, ENIG, keyword: Black Pad), insulation resistance under climate RIS, tendency towards Conductive Anodic Filament CAF
  • Whisker test as per DIN EN 60068-2-82/JEDEC-JESD 201
  • Thermal robustness of base material
  • Evaluation of inner structure (inner layer separation, barrel crack, corner crack)

Qualification of electronic components

  • Solderability as per DIN EN 60068-2-20, 2-58, 2-69, J-STD 002
  • Mechanical robustness by shear test, pull test and shock test as per DIN EN 62137
  • Breaking strength of ceramic capacitors as per DIN EN 60068-2-21 Test Ue1 Substrate Bending Test + Burn-in and Voltage Conditioning as per MIL-STD-202
  • Abrasion resistance of connectors
  • Connecting safety of connectors and switches under vibration load, failure of melting fuses, online measurements during tests
  • Current supply max. 12 kW (1x60V/100A, 2x60V/50A), high voltage test 5 kV~, 6kV~, max. 100mA
  • Life cycle test, internal power cycling
  • Measurement of characteristic curves of components R, C, L, XL, XC (recording curve), inductivities with DC-bias
  • Tantalum electrolytic capacitors: Surge test, parameter test as per MIL-PRF-55365
  • Whisker test

Qualification of auxiliary materials

  • SMD adhesive, e.g. hot shear test as per SN 59651 / IPC SM 817
  • Chemical resistance of polymers, stress crack corrosion e.g. as per DIN EN VDI 3822-2.1.7
  • Casting resin, e.g. dielectric strength as per IEC 243
  • Adhesive strength of self-adhesive labels
  • Properties of solder pastes, e.g. slumping, corrosion behavior
  • Fluxes, e.g. thermal resistance, interaction with solder resist
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