Deutsch

Delamination

Description:
Delamination is partial separation of the layers of the base material (PCB, multilayer). Their appearance (though smaller) is similar to that of blisters. Delamination is caused by humidity which the laminate has absorbed or which has been added during the production process. Applying heat leads to the formation of gases which then produce this result.

Causes/Remedy:
  • humidity in the (organic) base material
  • excessive thermal stress during soldering
  • This defect can be avoided through tempering

Source: visual, optical inspection - general view
delamination of base material

Description:
Same context as described above. Example of extensive delamination

Causes/Remedy:
  • humidity in the (organic) base material
  • excessive thermal stress during soldering

Source: visual, optical inspection - general view
extensive delamination of base material
ContactReferencesDisclaimerfacebook logogoogle+ logoyoutube logo