Excessive solder at CMC

more examples

Excessive solder on one side of a CMC. In accordance with IEC 61191 this solder joint has to be reworked. Solder joints such as this often cause rapid failure or possess bad mechanical properties.

  • unsuitable soldering parameter (temperature, soldering angle, etc.)
  • unsuitable soldering direction
  • wetting problems at the component/landing pads

Source: SEM
Excessive solder on one side of a CMC

Excessive solder at both ends caused by landing pads unsuited for this type of component. As a consequence the solder joints have adopted a nonconforming shape.

  • Layout / landing pads of component wrong/unsuited

Source: visual, optical inspection - general view
Excessive solder at both ends of a CMC
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