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Excessive solder at MiniMELF

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Description:
Excessive solder on one side of a MiniMelf after wave soldering.The shape of the soldering joint is still acceptable according to the standards, but the solder touches the component body. Therefore the fault is non-conforming. Rework is necessary.

Causes/Remedy:
  • poor soldering parameter (temperature, soldering angle, etc.)
  • unsuitable soldering direction
  • wetting problems at the component/landing pads


Source: visual, optical inspection - general view
Excessive solder at a MiniMELF

Description:
Same defect as described above. Rework necessary.

Causes/Remedy:
  • poor soldering parameter (temperature, soldering angle, etc.)
  • unsuitable soldering direction
  • wetting problems at the component/landing pads


Source: SEM
Excessive solder at a MiniMELF
back to excessive solder faults
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