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Excessive solder, general

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Description:
Solder accumulated at a wettable test point on the PCB. The solder accumulation has to be removed by suitable means because it impairs the subsequent electrical test.

Causes/Remedy:
  • poor parameter of the wave soldering process (soldering angle, temperature)
  • contamination of the solder / alloy
  • unsuitable flux / poor flux application


Source: SEM
Solder accumulation at a test point on a PCB
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