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Insufficient solder at DPAK

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Description:
Magnification of the previous example. The poor solder fillet at the heel is clearly visible.

Causes/Remedy:
  • poor/insufficient solder paste applied
  • wetting problems at the lead
  • unsuitable process temperature


Source: SEM
Insufficient solder at a DPAK

Description:
The leads on the other side also reveal problems with the solder fillet. Here the solder joints are acceptable though.(IEC 61191-2)

Causes/Remedy:
  • poor/insufficient solder paste applied
  • wetting problems at the lead
  • unsuitable process temperature


Source: SEM
Insufficient solder at a DPAK
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