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Microballs at SO

more examples
Description:
Single microballs between the solder joints of a SO16 after wave soldering. It is recommended to remove the microballs from the assembly if this can be easily done. It should be tested which solder stop masks especially favour the formation of microballs.

Causes/Remedy:
  • poor flux application
  • flux not active enough
  • unsuitable solder stop (surface)
  • unsuitable soldering process parameter

Source: SEM
Microballs at a SO16

Description:
Microballs on the casing surface of a SO14 after wave soldering. This easily detectable defect is very rare. It can be caused by unsuitable process parameter (soldering angle, soldering temperature, etc.) and a coarse surface of the IC.

Causes/Remedy:
  • unsuitable soldering parameter (soldering angle, temperature)
  • significant rise in the coarseness of the surface of the IC casing
  • Flux process favours formation of microballs

Source: visual, optical inspection - general view
Microballs at a SO14

Description:
Further example of microballs between the solder joints of a SO-IC after wave soldering.

Causes/Remedy:
  • poor flux application
  • flux not active enough
  • unsuitable solder stop (surface)
  • unsuitable soldering process parameter

Source: SEM
Microballs between the solder joints of a SO-IC

Description:
Further example of microballs between the solder joints of a SO-IC after wave soldering.

Causes/Remedy:
  • flux not active enough
  • unsuitable solder stop (surface)
  • unsuitable soldering process parameter

Source: visual, optical inspection - general view
Microballs between the solder joints of a SO-IC
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