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Opens at SOT23

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Description:
Open at a SOT23 (left) after wave soldering.

Causes/Remedy:
  • poor wettability of landing pads
  • shadowing effect due to poor layout for wave soldering


Source: SEM
Opens at a SOT23

Description:
Several opens at SOT23 components after wave soldering. The leads show residues of solder in contact with which they were during the soldering process. But there are no traces of solder on the landing pads. This indicates that soldering could not take place due to poor wettability of the landing pads

Causes/Remedy:
  • non-wettability of the contact configuration (pad)
  • shadowing effect (layout)
  • contamination of surfaces to be soldered
  • corrosion of surfaces to be soldered


Source: visual, optical inspection - general view
Open at a SOT23

Open at a SOT23

Description:
Open at a SOT23.

Causes/Remedy:
  • non-wettability of the contact configuration (pad)
  • shadowing effect (layout)
  • contamination of surfaces to be soldered
  • corrosion of surfaces to be soldered


Source: visual, optical inspection - general view
Open at a SOT23

Description:
Opens and lean solder fillets at a SOT 23 after wave soldering. The pads show only slight wetting or no wetting at all.

Causes/Remedy:
  • non-wettability of the contact configuration (pad)
  • shadowing effect (layout)
  • contamination of surfaces to be soldered
  • corrosion of surfaces to be soldered


Source: SEM
Open at a SOT23
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