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Tombstoning of MiniMELF

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Description:
Typical tombstoning of a MiniMELF in the reflow process. Clearly visible lifting-off of the component. ExtSEMe example

Causes/Remedy:
  • poor heat distribution during the reflow process
  • inhomogenous flow of heat energy, due to conductors of different widths
  • inhomogenous solder paste printing


Source: SEM
Tombstoning of a MiniMELF

Description:
Tombstoning at different stages. The wettability of the components influences this effect to a considerble extent.

Causes/Remedy:
  • poor heat distribution during the reflow process
  • inhomogenous flow of heat energy, due to conductors of different widths
  • inhomogenous solder paste printing


Source: SEM
Tombstoning of MiniMELF

Description:
Further example of tombstoning of a MiniMELF (bottom).

Causes/Remedy:
  • poor heat distribution during the reflow process
  • inhomogenous flow of heat energy, due to conductors of different widths
  • inhomogenous solder paste printing


Source: SEM
Tombstoning of a MiniMELF
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