Deutsch

SMD

SO-IC with gullwings

Description:
Dewetting of tinning at heel area of gullwing lead. The tinning has cracked, so that the copper underneath can corrode. The solderability of these components is jeopardized. Components which show such or a similar condition of their surface should not be used in production.

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: SEM
cracked tinning on the heel area of a gullwing lead

Description:
Dewetting and cracks at the bends of the gullwings of an SO-IC affecting all bends of the lead. Particular attention has to be paid to solderability, especially to the solder fillet at the lead heel. There is the constant risk of corrosion at the underlying carrier.

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: visual, optical inspection - general view
Dewetting and cracks at the bends of the gullwings of an SO-IC

SOD

Description:
Unevenly formed glass bodies of SO diodes. The fact that the geometry of the glass bodies does not correspond to the ideal form can lead to opens. It could well be that the components are not immersed in the solder paste on either side, which would enhance tombstoning. Furthermore it can clearly be seen that the glass bodies (left, middle) partly do not reach the contact areas. Solder would creep around the contact areas and touch the component body. This is unacceptable.

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: SEM
unevenly formed glass bodies of SO diodes

Description:
Dewetting of contact areas of SO diodes on arrival (middle, right). Using components with such appearances can lead to soldering defects since solderability is considerably reduced. There is the constant risk of corrosion at the contacts.

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: visual, optical inspection - general view
Dewetting of contact areas of SO diodes

Description:
Open at a SO diode due to a deviation in the form of the casing (banana diode). Its influence on solderability can clearly be seen.

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: SEM
Open at a SO diode

Cracks in Ta-capacitors Type C (6032)

Description:
Crack in the plastic casing of a Ta capacitor. This defect is likely to lead to a failure of the component. Another striking feature is the distinct burrs at the seams of the plastic parts and at the contacts.

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: visual, optical inspection - general view
Crack in the plastic casing of a Ta capacitor

Description:
Crack in the plastic casing (detailed view).

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: visual, optical inspection - general view
crack in a Ta-capacitor

SMD - inductivity (special component)

Description:
Damaged insulating wires of a SMD inductivity. The insulation has cracked due to mechanical stress. The design makes this component prone to mechanical damage.The defect shown can lead to bridging during wave soldering.

Causes/Remedy:
  • manufacturing fault
  • avoid using these components in general

Source: SEM
Damaged insulating wires of a SMD inductivity

Crack in MiniMELF

Description:
The body of this MiniMELF cracked during a solderability test. These components should pass the test without any problems and not show any defects at the body

Causes/Remedy:
  • manufacturing fault
  • replace such components

Source: visual, optical inspection - general view
crack in MiniMELF
ContactReferencesDisclaimerfacebook logogoogle+ logoyoutube logo