Optical inspection with microscope and microendoscope
- Bright field
- Dark field
- Interference contrast
- Polarization
- UV light
Laser topography
- optical surface scanning
- Roughness measurement
- Specimen size up to 300 x 300 mm
- Resolution up to 10 nm
Metallographic preparation techniques
- Specimen dimension up to 160 x 30 mm grinding surface
Dye and Pry Test
- Detection of cracks (microcracks) in BGA solder joints
Light Optical and Scanning Electron Microscopy (SEM)
- SEM inspection + analysis by energy or wavelength dispersive X-ray spectroscopy (EDX/WDX)
X-ray and ultrasound microscopy
- Specimen dimension up to 500 x 500 mm, resolution up to 5 µm
X-ray fluorescence (XRF/XRF)
- Qualitative and quantitative determination of the elemental composition and layer thickness determination of a sample
Fourier Transform Infrared Spectroscopy (FTIR)
- Identification of organic substances (polymers, adhesives, fluxes...)
Tension/compression test
- Mechanical tests, such as tension, compression, bending, shear and pull tests, as well as the determination of insertion, extraction and retention forces.
Ionic contamination measurement (J-STD-0001 / IPC-TM-650)
- Detection of ionogenic contaminants (e.g. process residues from PCB production, flux residues, etc.) on assemblies
- Adaptation of the process to customer-specific requirements
Hardness tests
- according to Shore, Knoop, Rockwell, Vickers, Brinell
Consulting
- Failure mechanisms of solder joints
- Failure mechanisms of components (e.g. ceramic capacitors)
- Failure mechanisms of printed circuit boards (keyword: black pad)
- Evidence reliability of test methods
- Evaluation of supplier agreements for technical relevance and feasibility
- Empirical determination of MTBF data
