failure analysis

Failure Analysis

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Optical inspection with microscope and microendoscope

  • Bright field
  • Dark field
  • Interference contrast
  • Polarization
  • UV light

Laser topography

Laser topography
  • optical surface scanning
  • Roughness measurement
  • Specimen size up to 300 x 300 mm
  • Resolution up to 10 nm

Metallographic preparation techniques

metallographic preparation
  • Specimen dimension up to 160 x 30 mm grinding surface

Dye and Pry Test

  • Detection of cracks (microcracks) in BGA solder joints

Light Optical and Scanning Electron Microscopy (SEM)

  • SEM inspection + analysis by energy or wavelength dispersive X-ray spectroscopy (EDX/WDX)

X-ray and ultrasound microscopy

  • Specimen dimension up to 500 x 500 mm, resolution up to 5 ┬Ám

X-ray fluorescence (XRF/XRF)

  • Qualitative and quantitative determination of the elemental composition and layer thickness determination of a sample

Fourier Transform Infrared Spectroscopy (FTIR)

  • Identification of organic substances (polymers, adhesives, fluxes...)

Tension/compression test

pull test
  • Mechanical tests, such as tension, compression, bending, shear and pull tests, as well as the determination of insertion, extraction and retention forces.

Ionic contamination measurement (J-STD-0001 / IPC-TM-650)

ionic contamination
  • Detection of ionogenic contaminants (e.g. process residues from PCB production, flux residues, etc.) on assemblies
  • Adaptation of the process to customer-specific requirements

Hardness tests

hardness test
  • according to Shore, Knoop, Rockwell, Vickers, Brinell


  • Failure mechanisms of solder joints
  • Failure mechanisms of components (e.g. ceramic capacitors)
  • Failure mechanisms of printed circuit boards (keyword: black pad)
  • Evidence reliability of test methods
  • Evaluation of supplier agreements for technical relevance and feasibility
  • Empirical determination of MTBF data