Thermal cycling tests are used to obtain a time lapse of processes that can lead to material fatigue due to the different coefficients of expansion.
Thermal stresses on e.g. assemblies with electronic components are caused by inhomogeneous temperature distribution in the materials. Changes up to the breakage of solders or components and/or inner layer cracks of copper connections occur. Materials are therefore characterized by their thermal shock or thermal shock resistance. Compressive, tensile and shear stresses are generated.
A distinction is made between slow and fast temperature change. While the slow temperature change rather simulates the reality, the fast temperature change (temperature shock) is to be preferred for very strongly time-graduated investigations.
- DIN EN 60068-2-33 Part 2 test N
- DIN IEC 60068 Part 2-30 alternating climate
- DIN IEC 60068 Part 2-38
- DIN EN 60068-3-1
- DIN SPEC 79009
- MIL STD 202 Meth. 107 G
- MIL STD 883 Meth. 1010
- MIL STD 750 Meth. 1021
- MIL STD 331 Meth. 105
- MIL STD 810 Meth. 503
- MIL E 5272 Test 4.4
- MIL-T 5422 E Part 4.4
- automotive standards (BMW, VW, etc.)