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Qualification of printed circuit boards

  • Rule conformity according to IPC-A-600, IEC 61288, e.g. thermal resistance (solder bath, oil bath, sand bath), solderability according to J-STD-003
  • Evaluation of end surfaces (chemical Sn, ENIG, keyword Black Pad), insulation resistance under climatic conditions RIS, tendency to Conductive Anodic Filament CAF
  • Whiskertest according to DIN EN 60068-2-82/JEDEC-JESD 201
  • thermal robustness of the base material
  • Evaluation of the internal structure (inner Layer-Separation, Barrel Crack, Corner Crack)

Qualification of electronic components

  • Solderability according to DIN EN 60068-2-20, 2-58, 2-69, J-STD 002
  • Mechanical load capacity in the Shear Test, Pull Test and Shock Test according to DIN EN 62137
  • Fracture strength of ceramic capacitors according to DIN EN 60068-2-21 Test Ue1 Substrate Bending Test + Burn-in and Voltage Conditioning according to MIL-STD-202
  • Abrasion resistance of connectors
  • Safety of contacting connectors and switches under vibration load, fuse failures, Online measurement during test runs
  • Power supply up to 12 kW (1x60V/100A, 2x60V/50A), high voltage test 5 kV~, 6kV~, max. 100mA
  • Life Cycle-Test, Internal Power Cycling
  • Component measurements R, C, L, XL, XC (Characteristic curve recording), Inductances with DC-Bias
  • Tantal-Elko: Surgetest, Parametertest according to MIL-PRF-55365
  • Whiskertest

Qualification of auxiliary materials

  • SMD adhesive, e.g. hot shear test according to SN 59651 / IPC SM 817
  • chemical resistance of polymers, stress corrosion cracking e.g. according to DIN EN VDI 3822-2.1.7
  • Casting resins, e.g. dielectric strength according to IEC 243
  • Adhesion of adhesive labels
  • Properties of solder pastes, e.g. slumping, corrosion behavior
  • Flux, e.g. thermal resistance, interaction with solder resist