Qualification of printed circuit boards
- Rule conformity according to IPC-A-600, IEC 61288, e.g. thermal resistance (solder bath, oil bath, sand bath), solderability according to J-STD-003
- Evaluation of end surfaces (chemical Sn, ENIG, keyword Black Pad), insulation resistance under climatic conditions RIS, tendency to Conductive Anodic Filament CAF
- Whiskertest according to DIN EN 60068-2-82/JEDEC-JESD 201
- thermal robustness of the base material
- Evaluation of the internal structure (inner Layer-Separation, Barrel Crack, Corner Crack)
Qualification of electronic components
- Solderability according to DIN EN 60068-2-20, 2-58, 2-69, J-STD 002
- Mechanical load capacity in the Shear Test, Pull Test and Shock Test according to DIN EN 62137
- Fracture strength of ceramic capacitors according to DIN EN 60068-2-21 Test Ue1 Substrate Bending Test + Burn-in and Voltage Conditioning according to MIL-STD-202
- Abrasion resistance of connectors
- Safety of contacting connectors and switches under vibration load, fuse failures, Online measurement during test runs
- Power supply up to 12 kW (1x60V/100A, 2x60V/50A), high voltage test 5 kV~, 6kV~, max. 100mA
- Life Cycle-Test, Internal Power Cycling
- Component measurements R, C, L, XL, XC (Characteristic curve recording), Inductances with DC-Bias
- Tantal-Elko: Surgetest, Parametertest according to MIL-PRF-55365
- Whiskertest
Qualification of auxiliary materials
- SMD adhesive, e.g. hot shear test according to SN 59651 / IPC SM 817
- chemical resistance of polymers, stress corrosion cracking e.g. according to DIN EN VDI 3822-2.1.7
- Casting resins, e.g. dielectric strength according to IEC 243
- Adhesion of adhesive labels
- Properties of solder pastes, e.g. slumping, corrosion behavior
- Flux, e.g. thermal resistance, interaction with solder resist
