Deutsch

Opens at BGA

more examples

Description:
Opens at a BGA. In this example many joints were not soldered due to the component lifting off on one side or due to thermal deformation.

Causes/Remedy:
  • Monitoring transport of components before and during the soldering process
  • Bear in mind popcorning effect of large plastic casings!

Source: Microsection
Opens at a BGA

Description:
Opens at a BGA. The gap between the solder depots to be joined is clearly visible. This defect is due to movements or lifting-off of the component. Attention: Such defects cannot always be detected with X-ray inspection systems.

Causes/Remedy:
  • Monitoring transport of components before and during the soldering process
  • Bear in mind popcorning effect of large plastic casings !

Bildquelle: Schliffbild
Nichtlötung eines BGA
back
ContactReferencesDisclaimerfacebook logogoogle+ logoyoutube logo