Solder bridges at CMC

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Solder bridge at a CMC. The solder has formed a bridge to the neighbouring, wettable area during the wave soldering process. Moreover the component is misaligned, which is probably due to adhesive not completely hardened. The component was shifted during soldering so that the minimum distance between adjacent wettable areas was not kept.
Moreover the adhesive reaches the componend landing pads

  • adhesive not completely hardened
  • unsuitable type of adhesive
  • too much adhesive
  • contaminated surface of component / adhesive force/wetting insufficient

Source: visual, optical inspection - general view
Solder bridge between a CMC and a neighbouring pad
back solder-bridges problems
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